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Products

We develop products for yield prediction and yield enhancement of IC layout. Our software tools and services are used by a number of large IC manufacturers, who are members of SEMATECH.
Yield Map Generated by EYES.
Yield Map Generated by EYES.

EYES -- Semiconductor Yield Estimation Tool

Our world beating yield prediction tool EYES has been leased to fabrication plants in the USA, Europe and Asia. The EYES tool uses the design layout and fabrication defect data to make a very accurate yield prediction. Predictions that are reliably better than +/- 1% have been reported (ST, Crolles). The tool uses a patented sampling technique to make it possible to quickly extract the critical areas of state-of-the-art chips. Yield reports are generated in simple text, html with chip maps and graphs, or in a spreadsheet format.

For more information click here.

PEYE-CAA: Critical Area Map
Critical areas displayed in a layout editor

PEYE-CAA -- Critical Area Extraction Tool

The PEYE-CAA tool is a version of Perl that has been linked to the eyes critical area library and additional display routines. This makes it suitable for detailed critical area analysis(CAA) of parts of a design or cell layout. This can be done interactively within a layout editor or if your editor is not supported, simply using a GDSII input and postscript output screen display. This capability allows designers to see the areas of a chip layout that are most sensitive to defects, and to measure the impact of their layout modification efforts on reducing the critical area. The tool is highly customizable.

For more information click here.

Try out a simple peye-caa script online at the www peye-caa interface.

PEYE: Redundant via addition
Redundant via additions to increase yield/reliability

PEYE -- Layout Analysis/Modifications to Enhance Yield

The PEYE tool is a version of Perl that has been linked to a sophisticated polygon library. This makes it a very flexible tool that can be used for simple operations, like generating and displaying critical areas, or more complex operations, such as analysing a layout for particalar features that might pose a DFM issue. It has even been used to automatically adding extra vias to an IC layout. The tool can be linked to the EYES tool to permit the measurement of layout features by the sampling method. Since the modifications are applied only to the samples, not the whole layout, detailed or complex analysis can be undertaken to determine the amount of a given feature and the regions of a chip where this feature is found. This enables a much more detailed analysis to be routinely performed than is usually practical.

For more information click here.




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