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Process Yield Enhancement

It is the faults that are caused by defects, not the defects themselves that cause yield loss.To make the best use of your yield enhancement efforts, it is important to know the yield loss associated with each defect type, not just the defect count.

The output of EYES gives not only the yield of the chip, but also a breakdown of the yield into the yield loss associated with different defect types. This information can be used to assess the real cost of defects and help target defect reduction efforts where they will be most cost effective.

Yield loss by fault type for the stacs_noimp chip.
Yield loss by fault type for the stacs_noimp chip.

Where the fault type does not correspond to a single defect type it can be split into one or more different fault types, associated with a particular defect type. This allows the yield loss of a particular defect type, with perhaps a know source, to be costed. A yield prediction will more accurately indication of the scale of the problem and can be used to estimate ROI from defect reduction measures targeted at those defects.

For example, there may be two defect types that cause shorts (classified as dome and pancake defects) and two defect types that cause contact/via fails (resist bubbles and straight forward "defects").

Yield loss by a finer classification of fault type.
Yield loss by a finer classification of fault type.



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